AI Accelerators — Presentation 02

SRAM Machines: Wafers, LPUs and IPUs

Put the weights in on-chip SRAM and memory bandwidth stops being the limit. The price is capacity: a whole wafer per few billion parameters, or hundreds of chips in a chain. Cerebras's wafer, Groq's statically scheduled LPU and Graphcore's bulk-synchronous IPU.

Wafer-scale Yield and spares Weight streaming Static schedule Pipeline chains Bulk-synchronous Latency
SRAM bandwidth → Capacity → Chips in a chain → Latency
00

Topics We’ll Cover

Live companion and sources

This deck follows chapter 4, wafer-scale, chapter 5, compiler-scheduled chips and the IPU part of chapter 6. Specifications, sources and access dates: the specifications page.

01

Why Put the Weights in SRAM

A decode step reads every weight once. On a GPU that read comes from HBM; put the weights in on-chip SRAM and the same read is orders of magnitude faster.

3.35 TB/s
H100 HBM bandwidth
80 TB/s
one GroqChip’s SRAM
21 PB/s
one Cerebras WSE-3’s SRAM

The price is capacity: 230 MB of SRAM per GroqChip and 44 GB per wafer, against 80 GB of HBM on one H100.

02

A Whole Wafer as One Chip

Cerebras skips the step every other chip takes, cutting the wafer into dies. The WSE-3 keeps 84 dies joined, with its fabric running across the scribe lines.

Cerebras WSE-3 (CS-3)Cerebras WSE-3 Turbo (CS-4)
Silicon (mm²)46,225 cs3-datasheet46,225 cs4-datasheet
Cores900,000 cs3-datasheet900,000 cs4-datasheet
On-chip SRAM44 GB cs3-datasheet44 GB cs4-datasheet
SRAM bandwidth21 PB/s cs3-datasheet43.2 PB/s cs4-datasheet
FP16 (sparse; dense not given)125 PFLOP/s cs3-datasheet250 PFLOP/s cs4-datasheet
System I/O1.2 Tb/s cs3-datasheet2.4 Tb/s cs4-datasheet
System power27 kW cs3-datasheetnot disclosed
Announced

The CS-4’s WSE-3 Turbo is announced, with first shipments “this quarter” on the access date. Cerebras gives compute only as a sparse FP16 figure; a compute term from it is a floor.

03

Surviving Defects Instead of Avoiding Them

$$\lambda = D_0 \cdot A, \qquad Y_{\text{perfect}} = e^{-\lambda}$$

Defects land at random, a density \(D_0\) per unit area. At an illustrative \(D_0\) = 0.1 per cm² (TSMC publishes none for N5):

44%
yield of an 814 mm² die that must be perfect
46.2
defects expected on the wafer
292
spares per expected defect (1.5% spare cores, illustrative)

A perfect wafer is essentially impossible. Cerebras makes defects small and survivable instead: each core is about 38,000 µm², so a defect costs one core of 900,000, and “redundant compute cores, redundant routing, and a fail-in-place architecture” route round it.

04

Models Across Wafers, and Weight Streaming

Llama 3.1 70B in 16 bits with its KV cache is 141 GB: 4 wafers, cut at layer boundaries. Cerebras’s inference service says exactly that: “70B models fit on as few as four systems”.

For training Cerebras streams the weights in from an external memory unit, one layer at a time, each applied to a whole batch held on the wafer. That suits training’s huge batches, not one user’s decode: streaming the 70B weights once over a CS-3’s 1.2 Tb/s of I/O takes 927 ms.

05

Compiler-Scheduled Chips: No Caches, No DRAM

Groq’s first LPU, the GroqChip, removes the last things a chip decides for itself. Its compiler fixes every instruction, memory read and chip-to-chip transfer to a cycle before the program runs (“statically scheduled, deterministic execution”, ISCA 2022): no cache misses, no arbitration, the same latency every time.

GroqChip (first-generation LPU)NVIDIA Groq 3 LPU (LPX rack)
SRAM230 MB groqchip-brief500 MB lpx-page
SRAM bandwidth80 TB/s groqchip-brief150 TB/s lpx-page
INT8 dense750 TOP/s groqchip-briefnot disclosed
FP8not disclosed1.23 PFLOP/s groq-home
Chip-to-chip (both ways)400 GB/s groq-isca222.5 TB/s lpx-page
Hop latency722 ns groq-isca22not disclosed
Power215 W groqchip-briefnot disclosed
Status

The GroqChip is retired (kept because published results used it); NVIDIA’s Groq 3 LPU is announced (“When released”), its hop latency not disclosed.

06

A Token Down a Chain of Chips

$$t_{\text{token}} = \frac{W}{g\,\beta_{\text{SRAM}}} + \big((S-1) + 2L\,[g>1]\big)\,t_{\text{hop}}$$

The model is cut into \(S\) stages of \(g\) chips; a token runs down the chain. Groq’s 2023 Llama 2 70B demonstration used 576 GroqChips in nodes of 8 (the fewest that hold it in INT8: 301).

108 µs
SRAM reads for one token
167 µs
hops at 722 ns each
3,640
tokens/s, one user, at the bound

More chips per stage divide the reading time but add an all-reduce hop per layer; more stages add hand-on hops. The latency is paid in hops, not bandwidth.

07

What the Published Speeds Say

CheckKindPublishedModelRatioSource
Llama 3.1 70B, 16-bit: CS-3 systems neededcapacity441cerebras-inference
Llama 2 70B, INT8: GroqChips used vs the fewest that hold itcapacity5763011.91nextplatform-groq
576 GroqChips, Llama 2 70B: tokens/s per user vs the boundlatency3003,6440.0823nextplatform-groq
4x CS-3, Llama 3.1 70B: tokens/s per user vs the boundlatency450150,7000.00299cerebras-inference
1x CS-3, Llama 3.1 8B: tokens/s per user vs the boundlatency1,8001,387,0000.0013cerebras-inference

The chip counts match. The speeds do not: the SRAM designs’ published speeds for one user are 0.13% to 8.2% of the bandwidth bound. Once the weights are in SRAM, bandwidth is not the limit; the published speeds imply 17.3 µs to 38.2 µs per layer beyond the bound, which the sources do not break down. Even so, these are the fastest one-user speeds in the site’s sources (450 tokens/s for 70B on four CS-3s).

08

The IPU: Bulk-Synchronous Tiles

Graphcore’s first-generation IPU (GC2) has 1,216 tiles, each a core with 262 kB of its own SRAM, 319 MB in all at 45 TB/s, and no other memory on the device. It runs the bulk-synchronous parallel model:

$$t_{\text{superstep}} = \max_{\text{tiles}} t_{\text{compute}} + t_{\text{sync}} + t_{\text{exchange}}$$

Compute

Every tile works on its own memory only.

Sync

All tiles stop at a barrier.

Exchange

Data moves between tiles on a schedule the compiler fixed.

Like an LPU chain, a model must fit in the tiles: Llama 3.1 70B in 16 bits needs 444 GC2s. Graphcore’s site lists no IPU products on the access date; the part is marked retired.

09

What to Take Away

Previous: deck 01, the design space. Next: deck 03, dataflow, meshes, edge and in-memory.