From INT8 pipelines and on-device LLMs to NPU scheduling, memory bandwidth management,
and the power-performance trade-offs that determine what runs on the edge — a rigorous
tour of how SoCs are architected specifically for inference workloads.
Training vs InferenceQuantisationINT8 / INT4 PipelinesOn-Device LLMsNPU SchedulingEdge vs CloudPower ManagementCase Studies
02
Training vs Inference — Fundamentally Different Problems
different bottlenecks demand different silicon
Training Characteristics
Forward + backward pass — 3× the compute of inference per sample
Key insight: INT8 cuts model size 4× vs FP32
and doubles throughput on Tensor Cores. INT4 halves again — at the cost of careful
per-group calibration to maintain accuracy.
SmoothQuant: migrates quantisation difficulty
from activations (large dynamic range) to weights (stable range) via a per-channel
smoothing factor — enabling accurate W8A8 without QAT.
05
INT8 & INT4 Hardware Pipelines
from MAC arrays to dequantisation and accumulation
INT4 Weight-Only Quantisation (W4A16)
Weights stored as INT4, unpacked to FP16 before MAC — no INT4 accumulator needed
2× weight load bandwidth saving vs INT8 — critical for memory-bound GEMV
GPTQ: second-order Hessian-guided rounding; per-group scale every 128 weights
AWQ (Activation-Aware): protects salient weights by per-channel scaling
Hopper H100 has no native INT4 Tensor Core (removed after Ampere); W4A16 dequantises INT4 weights to FP16 before MMA. Ampere A100 retains INT4 at 1,248 TOPS sparse.
Tensor Core Evolution (NVIDIA)
Generation
GPU
Formats
Peak TOPS
V1 (Volta)
V100
FP16
125
V2 (Turing)
T4
INT8, INT4
130 / 260
V3 (Ampere)
A100
BF16, TF32, INT8
312 / 624
V4 (Hopper)
H100
FP8, INT8, INT4
3,958 (INT8)
V5 (Blackwell)
B200
FP4, FP6, FP8
9,000+ (FP4)
Accuracy vs Efficiency Trade-off
FP32 baseline0.0% accuracy loss
BF16 / FP16<0.1% — lossless in practice
W8A8 INT8 (PTQ)<0.5% on most tasks
W4A16 GPTQ0.5–2% typical; task-dependent
W4A8 (aggressive)1–4% — needs careful calibration
W2 / binaryLarge loss except specialised nets
Rule of thumb: INT8 is generally safe for
large models (>7B); INT4 requires per-group quantisation and calibration for <2%
accuracy loss. Below 7B parameters, quantisation sensitivity rises sharply.
06
The LLM Inference Pipeline
prefill · decode · KV-cache — three distinct hardware problems
Prefill/decode disaggregation: route prefill to compute-optimised
nodes (batch GEMM), decode to bandwidth-optimised nodes (high HBM BW). Used in
production at scale by Google, Anthropic, and OpenAI.
07
Memory Bandwidth — The Dominant Inference Bottleneck
why decode is nearly always memory-bound
Arithmetic Intensity of Inference Operations
Large GEMM (prefill, large batch)100–500+ FLOP/B
GEMV (decode, batch=1)1–4 FLOP/B
Attention (prefill, seq=2K)~15 FLOP/B
Attention (decode, KV-load)<2 FLOP/B
MoE routing + expert GEMM~20 FLOP/B
LayerNorm / elementwise<1 FLOP/B
H100 SXM5 Roofline
Peak FP16 TFLOPS989
HBM3 bandwidth3.35 TB/s
Ridge point295 FLOP/B
GEMV (batch=1)~2 FLOP/B ← far below ridge
Practical GPU utilisation (decode)<5%
Implication: A 70B model decode pass
on H100 utilises roughly 0.7% of available FLOPS. The silicon is mostly idle —
waiting for weights and KV vectors to arrive from HBM.
Escaping the Memory Wall
Batching
Increase batch size → weights amortised across many tokens → higher FLOP/B. Continuous batching (iteration-level scheduling) in vLLM, SGLang.
Speculative Decoding
Draft model proposes N tokens, target model verifies in parallel. Achieves 2–3× decode speedup at same quality — turns serial decode into a parallel verification GEMM.
Quantisation (W4)
INT4 weights: 4× fewer bytes from HBM per token. Direct bandwidth improvement — 70B model ≈ 35 GB at INT4 vs 140 GB at FP32.
Near-Memory Compute
Samsung HBM-PIM, SK Hynix AiM — DRAM with embedded compute. Eliminates off-chip BW entirely for targeted operations.
FlashAttention sparsity: Online softmax
computation with block-sparse attention masks. O(N) HBM reads vs O(N²) for
standard attention — transforms attention from memory-bound to compute-bound
for long contexts.
Speculative Decoding as "temporal sparsity":
small draft model generates candidate tokens; large model verifies N at once.
Effective throughput gain: 2–4× on typical LLM tasks without quality loss.
10
On-Device LLM SoC Architecture
unified memory, heterogeneous compute, and the Apple M-series blueprint
Unified Memory Architecture Advantages
Zero-copy — GPU tokenises, NPU runs LLM decode, CPU runs runtime logic — all share the same physical DRAM pages
Coherent — no explicit DMA transfers or pinned buffers between engines
LLM-friendly — 70B INT4 model ≈ 35 GB: fits M3 Ultra (192 GB) easily; fits M4 Pro (48 GB) at smaller models
Bandwidth pooled — 120–800 GB/s shared; no PCIe bottleneck (≤64 GB/s)
Heterogeneous Dispatch Strategy
Tokenisation / samplingCPU (low latency)
Prefill (long prompt)GPU (parallel GEMM)
Decode (token gen)NPU (low power, INT4)
Embedding lookupCPU cache-friendly
KV-cache managementCoreML runtime
Apple Intelligence (iOS 18.1+) runs 3B on-device model on ANE with stateful
KV-cache — persistent state across calls eliminates re-prefill overhead.
MLX framework enables research-grade flexibility on the same hardware.
11
Mobile & Edge NPU Comparison
flagship SoC inference capabilities — 2024/2025
SoC
NPU
TOPS
Process
Memory
BW
LLM Capability
TOPS/W est.
Apple A18 Pro
ANE Gen 5
38
TSMC N3E
8–16 GB LPDDR5X
120 GB/s
On-device 3B INT4
~45
Apple M4
ANE Gen 5
38
TSMC N3E
16–32 GB LPDDR5X
120 GB/s
7B–13B INT4
~50
Qualcomm SD X Elite
Hexagon NPU
45
TSMC N4P
32–64 GB LPDDR5X
135 GB/s
13B–30B INT4
~35
Qualcomm SD X2 Elite
Hexagon NPU
80
TSMC N3
—
—
Windows AI PC (2025)
—
Qualcomm SD 8 Gen 3
Hexagon NPU
45
TSMC N4P
8–16 GB LPDDR5X
77 GB/s
7B INT4
~38
Samsung Exynos 2500
Mach-1 NPU
40
Samsung 3GAP
12 GB LPDDR5X
77 GB/s
7B INT4
~30
MediaTek D9400
APU 790
50
TSMC N3E
12–16 GB LPDDR5T
102 GB/s
7B–13B INT4
~40
Google Tensor G4
TPU (custom)
~17
Samsung 4nm
12 GB LPDDR5X
68 GB/s
Gemini Nano INT8
~25
Memory bandwidth is the binding constraint
for on-device LLMs. TOPS matters little if the DMA can't feed the NPU fast enough.
Qualcomm's 135 GB/s explains why SD X Elite runs larger models than A18 Pro despite
similar TOPS.
INT4 is the practical sweet spot
for on-device: 7B model = ~3.5 GB at W4, fits in 8 GB LPDDR with headroom for
activations and OS. INT8 doubles this to ~7 GB — tight for 8 GB devices.
12
Power Management for ML Inference
DVFS, power domains, and thermal budget
Inference Power Breakdown (Mobile NPU)
MAC Array
~55%
SRAM (scratchpad)
~25%
DMA / Fabric
~12%
Control / Scheduler
~8%
SRAM leakage grows with size; at 16 MB+ scratchpad, SRAM can exceed MAC array power at idle.
DVFS Strategy for NPU
Compute-bound ops (prefill, large conv): max frequency, max voltage — utilise Tensor Cores fully
Memory-bound ops (decode GEMV): reduce NPU frequency; performance limited by DRAM BW not clock
Clock gating — idle MAC rows gated cycle-by-cycle; partial utilisation common in sparse layers
Power gating — entire NPU domain powered down between inference requests; critical for mobile
Thermal Management
TDP envelope — mobile: 3–8 W sustained; tablet: 5–15 W; thin laptop: 10–25 W
Thermal throttling — PMIC and thermal sensor feedback; frequency reduced when Tj > 85–95°C
Workload spreading — PPEM (Performance-Per-Milliwatt) scheduling; distribute load across CPU, GPU, NPU to balance heat
Sustained vs burst — Apple M4: 38 TOPS sustained, ~50 TOPS burst (10 s); throttling policy is OS-controlled
Vapour chamber / heat pipe — Snapdragon X Elite laptop: required for 45W PC TDP
Energy Minimisation Techniques
Zero-skipping — detect zero activations before MAC; save dynamic power proportional to sparsity
Data compression — compress activations in SRAM to DRAM transfers; reduce bandwidth energy (α 0.5–1 pJ/bit saved)
Near-threshold compute — sub-0.5 V operation for background inference; 10× energy reduction at 10× slower frequency
Quantisation — INT4 vs FP16: 4× fewer bits moved → ~4× DRAM energy saving (dominant energy source)
13
The Inference Compiler & Runtime Stack
from model checkpoint to efficient silicon execution
Key Optimisation Passes
Operator fusion — MatMul + GELU + residual add as single kernel; eliminates intermediate tensor writes
Constant folding — embed quantisation scales, bias, and fixed masks into weight tensors at compile time
Tiling & scheduling — partition tensors to fit SRAM; schedule DMA ahead of MAC by Δt = DMA_latency
Kernel selection — cuDNN / TensorRT chooses fastest kernel variant at runtime via auto-tuning
Inference Runtimes Compared
TensorRT (NVIDIA)INT8 engine, graph fusion, FP8
vLLMPagedAttention, continuous batching
SGLangRadixAttention, prefix caching
llama.cppCPU + GPU, GGUF Q4/Q8, portable
CoreML / ANEStateful KV, on-device Apple
ONNX RuntimeCross-platform EP dispatch
Triton / OpenAI: Python-embedded DSL that
compiles to GPU PTX; enables research teams to write custom attention kernels
(FlashAttention-2/3) at near-cuBLAS efficiency without CUDA expertise.
14
TinyML — Inference at the Extreme Edge
sub-milliwatt neural networks on microcontrollers
Constraints
Flash (model)256 KB – 4 MB
SRAM (inference)32 KB – 512 KB
Clock16 – 400 MHz
Power budget<1 mW – 100 mW
Latency target<10 ms (keyword)
Battery lifeYears on coin cell
Model Architectures
MobileNetV3-Small — 1.5 MB, INT8, ~2 ms on Cortex-M55
Edge Impulse — cloud training → TFLM/EON deployment pipeline
Quantisation for TinyML
Full INT8 post-training — TFLite converter + representative dataset; fits 256 KB SRAM with careful planning
Layer-wise mixed precision — sensitive first/last layers in INT16, bulk in INT8; automated by TFLite
Power-of-2 scales — scale = 2^(-n); replace multiply by shift; critical for shift-only MCUs (no multiplier)
Activation range clipping — aggressive clipping during QAT narrows dynamic range → better INT8 fidelity
Ethos-U55 / U65 architecture: 64 or 512 MAC
units, weight streaming from Flash via DMA, activation SRAM double-buffered. Power: 8 mW
at 64 MACs/cycle. A keyword spotting network runs continuously on Ethos-U55 at
<0.1 mW average — less than an LED.
15
CNN Inference Optimisation
convolution, tiling, im2col, and depthwise separability
Conv2D as GEMM — im2col Transform
Input feature map patches unrolled into rows of an Toeplitz matrix (im2col)
maximising GPU utilisation across concurrent requests
Static vs Continuous Batching
Static batching — pad all sequences to max length; wait for full batch before starting; simple but wasteful
Continuous (iteration-level) batching — insert new requests at token boundaries; no waiting; GPU utilisation 2–3× higher
Chunked prefill — interleave prefill chunks with decode tokens; prevents decode starvation during long prompts
PagedAttention (vLLM)
KV-cache fragmentation wastes 20–40% of GPU memory in naive implementations
PagedAttention: KV stored in fixed-size pages (e.g. 16 tokens); pages non-contiguous in physical memory like OS virtual memory
Copy-on-write for prefix sharing — same prompt prefix shared across many requests
Enables 3× more concurrent requests at same GPU memory budget
Prefix Caching & Radix Attention
Prefix caching — reuse KV-cache of repeated system prompts (chatbot context, RAG documents) across requests
SGLang RadixAttention — LRU cache of KV blocks indexed by token sequence hash; hit rate >80% in multi-turn workloads
Speculative decoding integration — draft and verify within same batch, sharing KV-cache pages
Latency vs throughput trade-off:
larger batch → better GPU utilisation (throughput) but higher time-to-first-token
(TTFT). Disaggregated prefill/decode routing resolves both simultaneously at
hyperscale — separate pools for each optimisation objective.
Model doesn't fit one device — Llama 3.1 405B FP16: 810 GB; requires 10+ A100 80GB
Latency requirements — distribute GEMM across devices → smaller per-device matrix → lower latency per layer
Throughput scaling — additional devices handle more concurrent requests
Tensor Parallelism (Megatron-LM)
Column-parallel: split weight matrix along output dimension; each GPU computes partial output columns
Row-parallel: split along input dimension; each GPU holds partial input rows; all-reduce to combine
MLP sharding: FFN first Linear column-parallel, second row-parallel — one all-reduce per transformer block
Attention sharding: Q,K,V heads distributed across GPUs; each GPU handles subset of heads
Communication: all-reduce per layer — NVLink 5 (1.8 TB/s) vs PCIe (64 GB/s) matters enormously
Pipeline Parallelism
Transformer layers partitioned into stages; each GPU holds a stage
GPipe micro-batching: split batch into micro-batches; pipeline flush eliminates bubble
1F1B interleaved (Megatron): interleave forward/backward across stages; ~1/N pipeline bubble
Communication: point-to-point activation tensors between stages — lower volume than all-reduce but sequential
Inference-only: no backward pass — pipeline bubble eliminated; pure latency / throughput balance
Expert Parallelism (MoE)
MoE experts distributed across GPUs — each GPU owns subset of experts
All-to-all dispatch: route tokens to correct GPU for expert execution — dominant communication cost
DeepSpeed-MoE, Tutel — dynamic load-balancing to handle expert load imbalance
Combined TP + EP for Mixtral: tensor-parallel within expert, expert-parallel across nodes
LLM serving at hyperscale:
GPT-4 class models use TP=8 within a node (NVLink) + PP across nodes (InfiniBand).
Expert parallelism on top for MoE — 3D parallelism in production.
18
Case Study: NVIDIA H100 / H200 for Inference
the dominant cloud inference platform — 2024
H100 SXM5 Specifications
ProcessTSMC N4 (4nm)
Transistors80 billion
SMs132 (MIG: up to 7 instances)
FP8 TOPS (sparse)3,958
INT8 TOPS (sparse)3,958
HBM3 capacity80 GB
HBM3 bandwidth3.35 TB/s
NVLink 4 bandwidth900 GB/s
TDP700 W
H200 — Memory Upgrade
HBM3E capacity141 GB
HBM3E bandwidth4.8 TB/s
LLM decode speedup vs H100~1.9× (BW-bound)
Llama 3.1 70B fits without offload?Yes — 35 GB INT4
Hopper Inference Features
Transformer Engine — FP8 Tensor Cores; dynamic per-layer precision selection; loss-free FP8 inference for most LLMs
WGMMA (Warpgroup MMA) — asynchronous matrix multiply across warp groups; decouples data movement from compute
MIG (Multi-Instance GPU) — partition H100 into up to 7 isolated inference instances; efficient for small-model serving
Confidential Computing — TEE for sensitive inference workloads (medical, financial)
Inference Performance (Llama 3.1 70B, INT8)
1× H100 SXM5 (batch=1)~30–50 tok/s decode
1× H200 (batch=1)~55–80 tok/s decode
8× H100 NVL (TP=8, batch=32)~1,800 tok/s
Time-to-first-token (4K prompt)~200–400 ms
Bottleneck (batch=1)HBM bandwidth
19
Case Study: Qualcomm Cloud AI 100 Ultra
purpose-built inference ASIC — not a repurposed training GPU
AI 100 Ultra Specifications
ProcessTSMC 5nm
INT8 TOPS870
On-chip SRAM128 MB
LPDDR5X memory136 GB
Memory bandwidth2.2 TB/s
TDP150 W
TOPS/W (INT8)~5.8 — vs H100's ~5.7
Form factorHHHL PCIe card
LPDDR vs HBM trade-off: LPDDR5X is
cheaper per GB than HBM3, enabling 136 GB at lower cost. Bandwidth (2.2 TB/s) lags
HBM3 (3.35 TB/s) but for INT4 decode the gap narrows — 4× fewer bytes fetched
per weight element.
Inference-First Architecture Choices
No FP64 / FP32 training paths — die area focused entirely on INT8/INT4 MAC arrays and SRAM
128 MB on-chip SRAM — KV-cache tiers: hot tokens in SRAM, cold in LPDDR; reduces off-chip reads for short-context decode
Multi-chip module — two dies per Ultra card; 2× die yield benefit from smaller die; NVLink-equivalent internal interconnect
Compiler-driven scheduling — Qualcomm's AIC compiler statically schedules all DMA and compute; no dynamic dispatch overhead
Network-attached inference — designed for rack-scale pod with PCIe fabric; flexible scaling from 1 to 64 cards
Competitive Positioning
Metric
H100 SXM5
AI 100 Ultra
INT8 TOPS
3,958
870
Memory
80 GB HBM3
136 GB LPDDR5X
BW
3.35 TB/s
2.2 TB/s
TDP
700 W
150 W
TOPS/W
~5.7
~5.8
20
Case Study: Groq LPU — Compiler-as-Hardware
deterministic dataflow execution for ultra-low inference latency
Groq TS-P1 Specifications
ArchitectureTensor Streaming Processor
ProcessTSMC 14nm (TS-P1)
On-chip SRAM230 MB — vast scratchpad
INT8 TOPS188
Memory bandwidth80 TB/s (SRAM bandwidth)
External memoryNone — model must fit in SRAM
TDP300 W
Llama-3.3 70B tok/s (standard)~280 tok/s
Llama-3.3 70B tok/s (w/ spec-dec)~1,665 tok/s
80 TB/s SRAM bandwidth completely
eliminates HBM as the bottleneck — GEMV becomes compute-bound, not memory-bound.
Result: 750 tok/s single-stream latency vs H100's ~50 tok/s — 15× faster decode.
Tensor Streaming Processor Principles
No caches, no branch prediction, no out-of-order execution — compiler determines all data movement statically at compile time
Deterministic execution — every instruction scheduled at compile time; zero runtime overhead
Spatial dataflow — data streams through fixed functional units in programmed order; no dynamic dispatch
230 MB SRAM — holds model weights of 8B INT8 entirely on-chip; zero HBM stall for decode
Compiler = hardware — Groq Compiler expresses the full execution plan; chip is a programmable dataflow engine
Trade-offs & Limitations
Model size ceiling — 70B INT4: ~35 GB; requires 200+ chips in a GroqRack for on-chip storage
No dynamic shapes — variable-length sequences require recompilation or padding
Older process (14nm) — raw TOPS far below H100; wins purely on bandwidth-to-compute ratio
Data poisoning — fine-tuning attacks; hardware signing of model checkpoints provides provenance
On-device privacy advantage: edge inference
never transmits user data to cloud — inference is local by design. Apple Intelligence
Private Cloud Compute extends this: cloud inference uses TEE, no user data retained,
independently auditable firmware.
Differential privacy for output: adding
calibrated noise to logits before sampling provides formal privacy guarantees in
scenarios where model outputs might leak training data membership.
22
Emerging Inference Techniques
speculative decoding · medusa · SSMs · analog compute
Speculative Decoding — Deep Dive
Algorithm: draft model generates K tokens autoregressively; target model verifies all K+1 in single forward pass (parallel GEMM)
Acceptance probability: p_accepted = min(1, p_target / p_draft) per token via rejection sampling
Speedup: K_accepted × (T_target / T_draft) — effective when draft model is 10–50× smaller
Self-speculative (Medusa, Eagle): draft heads attached to target model; share hidden states
EAGLE-3 (NeurIPS'25): feature-level speculative decoding with multi-layer fusion; 2–6.5× speedup over vanilla decode; now the standard spec-dec head in vLLM and SGLang. Medusa / EAGLE-2 remain common.
Hardware implication: turns memory-bound GEMV decode into compute-bound GEMM verification — transforms the roofline operating point
State Space Models (Mamba / S4)
Alternative to Transformer attention; recurrent state representation with linear-time decode
Inference advantage: O(1) memory per token (fixed state vector vs O(N) KV-cache growth)
Hardware implication: no KV-cache → no KV bandwidth bottleneck; fits tiny SRAM even at long context
Mamba-2: structured state space; selective SSM — matches Transformer quality at 1B+ parameters
Hybrid architectures (Jamba, Zamba): interleaved attention + SSM layers — best of both
Analog & Photonic Compute
Analog in-memory compute (IBM PCM/ReRAM): GEMV at 85 TOPS/W; no weight movement → zero DRAM bandwidth energy
Photonic MAC (Lightmatter Passage): optical matrix multiplication at speed-of-light; 0 dynamic power for MAC
3D SRAM-on-logic (TSMC SoIC): >100 TB/s on-die bandwidth — Groq-style architecture at advanced node
23
Power-Performance Trade-off Summary
TOPS/W across the deployment spectrum
Device / Accelerator
Class
Process
Peak TOPS
TDP
TOPS/W
Best Fit
Arm Ethos-U65 (512 MACs)
TinyML MCU
Any
0.5
8 mW
~60
Keyword, IMU, gesture
Apple ANE (A18 Pro)
Mobile
N3E
38
~1.5 W
~45
On-device 3B LLM, CV
Qualcomm Hexagon (SD 8 Gen 3)
Mobile
N4P
45
~2 W
~38
7B INT4 on Android
Groq TS-P1
Inference ASIC
14nm
188
300 W
~0.6
Ultra-low latency LLM (SRAM-resident)
Qualcomm AI 100 Ultra
Inference ASIC
5nm
870
150 W
~5.8
Cost-efficient LLM serving
NVIDIA H100 SXM5
Data Centre GPU
N4
3,958
700 W
~5.7
Training + inference, large batches
NVIDIA H200
Data Centre GPU
N4
3,958
700 W
~5.7
Large model BW-optimised inference
AMD MI300X
Data Centre GPU
N5/N6
5,220
750 W
~7.0
Large model, 192 GB HBM3
Google TPU v5p
TPU
7nm
459 (BF16)
450 W
~1.0
Google internal, TPU pods
TOPS/W divergence: edge NPUs achieve
40–60 TOPS/W; datacenter GPUs sit at 5–7 TOPS/W. The 10× gap reflects power delivery,
cooling infrastructure, and the absence of DRAM bandwidth overhead on-edge
with unified memory.
Selection criteria: choose by model size
(requires DRAM capacity), latency requirement (requires SRAM bandwidth or low-latency
fabric), throughput (requires TOPS × utilisation), and cost-per-token (TCO analysis
including power, rack space, and DRAM cost).
24
Summary & Key Takeaways
SoCs for ML Inference
Core Principles
Memory Bandwidth Dominates
Inference decode is bandwidth-bound at batch=1. The right question is not TOPS but bytes-per-second from DRAM to MAC array.
Quantisation Is Non-Optional
INT8 is the minimum for production LLM inference; INT4 with per-group scaling is the practical edge sweet spot. FP8 is training's gift to inference.
KV-Cache Shapes System Design
Context length × batch size × precision × layers determines DRAM capacity requirement. PagedAttention and GQA are mandatory at scale.
Heterogeneous Compute Wins
CPU + GPU + NPU unified memory (Apple, Qualcomm) or tensor + pipeline + expert parallelism (hyperscale) — no single accelerator type is optimal for all phases.
Compiler Is Co-Designer
Operator fusion, tiling, and DMA scheduling are as important as silicon. Groq's compiler-as-hardware is the extreme case; every NPU requires this thinking.
Emerging Directions
FP4 / FP6 — Blackwell native FP4; model quality at sub-INT4 bitwidths approaching INT8 with careful calibration
State Space Models — Mamba / Jamba eliminate KV-cache; O(1) decode memory enables extreme context lengths
Speculative + medusa decoding — becoming standard in production serving stacks
Analog / photonic compute — elimination of weight movement energy; 10–100× efficiency gains demonstrated in research
Near-memory compute — HBM-PIM, 3D SRAM-on-logic: bring compute to data rather than data to compute
On-device foundation models — 7B–13B running locally at <10 W is now engineered reality
Series Navigation
✅ 01 SoC Packaging✅ 02 On-Chip Interconnect✅ 03 Memory Hierarchy✅ 04 SerDes & I/O✅ 05 AI/ML Accelerator Architectures▶ 06 SoCs for ML Inference07 Security in SoC08 CXL in ML SoCs… 13 Clocks & Resets