MODERN SOC DESIGN · PRESENTATION 02

On-Chip Interconnect
& NoC Design

Buses · Crossbars · Networks-on-Chip · Coherency · QoS
AMBA AXI · ACE · CHI · Mesh · Ring · Torus · Routing · Arbitration · Snoop Filters · MESI · CXL
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02

Why Interconnect Matters

  • Bandwidth ceiling — modern SoCs have 100+ IP blocks; the interconnect determines aggregate throughput between them
  • Latency floor — cache miss to DRAM is dominated by NoC traversal + memory controller queuing, not DRAM access time
  • Power budget — interconnect consumes 30–40% of total SoC dynamic power; wire energy dominates at advanced nodes
  • Design reuse — a well-designed NoC allows IP blocks to be swapped, added, or removed without backend redesign
The communication subsystem consumes 30–40% of total SoC chip resources and is the primary determinant of system-level performance.
Trend: from shared buses (AHB, 2000s) → crossbar switches (NIC-400) → packet-switched NoC (CMN-700, Arteris FlexNoC) as IP block counts and bandwidth demands scale.
03

Interconnect Evolution

Shared bus → Crossbar → Network-on-Chip

04

Shared Bus Architecture

AMBA AHB / APB

CPU
DMA
GPU
Shared Bus (AHB) — single manager at a time
SRAM
Flash
MMIO

An arbiter grants one manager access at a time. All subordinates share the same address/data wires.

Characteristics

  • Simple — minimal area, easy verification
  • Pipelined — AHB uses address + data phases
  • Single-master bottleneck — only one transaction at a time on the bus
  • Non-scalable — adding masters degrades throughput linearly

Where It Still Works

  • APB — low-bandwidth peripheral register access (UART, SPI, I²C config registers)
  • AHB-Lite — single-manager subsystems (sensor hubs, audio DSPs)
  • MCUs with ≤4 bus masters and ≤1 GHz clock
05

Crossbar Switch Architecture

M0
M1
M2
M3
N×M Crossbar Switch — concurrent non-conflicting paths
S0
S1
S2
S3

Multiple concurrent transactions as long as they target different subordinates. Conflicts arbitrated per-subordinate port.

Crossbar Properties

  • Parallel paths — M0→S2 and M1→S0 proceed simultaneously
  • Low latency — single-hop, no store-and-forward
  • Wire cost — grows as O(N×M); practical limit ~16×16 ports
  • Centralized — all arbitration in one block; routing congestion

Examples

  • Arm NIC-400 — configurable AXI crossbar for mid-range SoCs
  • Synopsys DW_axi — DesignWare AXI interconnect matrix
  • Most FPGA soft-core SoCs (Xilinx AXI Interconnect IP)
06

Network-on-Chip (NoC)

A NoC replaces ad-hoc global wires and centralized crossbars with a packet-switched network of distributed routers connected by point-to-point links.

Three Building Blocks

  • Network Interface (NI) — converts IP transactions (AXI/CHI) to network packets and back; handles protocol isolation, clock/power domain crossing
  • Router — receives packets, performs routing lookup, arbitrates between inputs, forwards to output port; typically 3–5 pipeline stages
  • Link — physical wires between routers; can be pipelined for long distances; defines raw bandwidth (width × frequency)

Why NoC over Crossbar?

PropertyCrossbarNoC
ScalabilityO(N²) wiresO(N) links
Max ports~16100s
Wire lengthGlobalLocal (hop)
Multi-clockHardPer-NI
Latency (min)1 cycle3–10 cycles
ReusabilityLowHigh
07

NoC Topologies

Mesh · Torus · Ring · Tree · Hierarchical · Application-specific

08

Common NoC Topologies

TopologyStructureDiameter (N nodes)Bisection BWStrengthsWeakness
2D Mesh Grid, 4 neighbors 2(√N − 1) √N links Regular, easy to layout, locality Edge asymmetry, center congestion
Torus Mesh + wrap-around √N 2√N links Edge symmetric, lower diameter Long wrap-around wires, hard to route
Ring Circular, 2 neighbors N/2 2 links Simplest, minimal area High diameter, low bisection BW
Fat Tree Hierarchical switches 2·log₂N N/2 links High bisection BW, good for uniform traffic Root bottleneck, complex layout
Hierarchical Multi-tier (cluster + global) Varies Varies Matches SoC hierarchy, power isolation Design complexity, non-uniform latency
2D Mesh dominates commercial SoC NoCs (Arm CMN-600/700, Intel mesh, AMD Infinity Fabric) because its regular structure simplifies physical design, timing closure, and floorplanning.
09

Mesh in Practice — Arm CMN-700

CPU
XP
CPU
PCIe
XP
SLC
SLC
XP
CPU
SLC
SLC
CPU
DDR
XP
XP
DDR

Simplified 4×4 mesh showing cross-point routers (XP), CPU clusters, SLC slices, DDR and PCIe

Max mesh12×12 (144 XPs) per die
ProtocolAMBA 5 CHI (Issue E)
SLCUp to 512 MB distributed system cache
Snoop filterDirectory-based, per HN-F node
Multi-chipCXL 2.0/3.x via CXS (CMN S3: CXL 3.x native)
CPUsUp to 256 cores (512 in 2-chip)
MemoryDDR5, HBM3, CXL memory

Used in AWS Graviton3/4, Ampere AmpereOne, NVIDIA Grace, and many HPC/networking SoCs.

CMN S3 (current): 32 CCG (CXL 3.0 gateway), 512-bit CXS Issue B, up to 256 cores with 512 MB SLC, confidential compute, Armv9.2. CMN S3AE (2025) targets automotive chiplet designs.

10

The AMBA Protocol Suite

APB · AHB · AXI · ACE · CHI — the lingua franca of SoC interconnect

11

AMBA Protocol Evolution

YearSpecProtocolKey InnovationUse Case
1996AMBA 1 ASB, APB First standardized on-chip bus MCU peripherals
1999AMBA 2 AHB Single-edge pipelined bus, burst Embedded processors
2003AMBA 3 AXI3 5 independent channels, OoO, burst High-perf SoCs
2010AMBA 4 AXI4, ACE, AXI-Stream 256-beat burst, QoS, coherency (ACE) Mobile AP, big.LITTLE
2013AMBA 5 CHI Packet-based layered protocol, scalable coherency Server, HPC, AI SoCs
2025AMBA 5 AXI Issue J (AXI-J), CHI Issue F AMBA-J transaction flows, APB Issue E, extended RAS Automotive safety, AI

All AMBA specifications are royalty-free and publicly available from Arm.

12

AMBA AXI — Five Channel Architecture

Manager → Subordinate & Subordinate → Manager

AW
Write Address
W
Write Data + Strobe
B
Write Response
AR
Read Address
R
Read Data + Response

Each channel uses independent xVALID / xREADY handshake — channels decouple fully for maximum throughput.

Key AXI Features

  • Burst transfers — FIXED, INCR, WRAP; up to 256 beats (AXI4)
  • Out-of-order — responses can return in any order using transaction IDs
  • Multiple outstanding — manager issues N requests before first response returns
  • Write strobes — WSTRB enables per-byte lane masking
  • Protection — AxPROT[2:0]: privileged/unprivileged, secure/non-secure, instruction/data
  • Cache hints — AxCACHE[3:0]: bufferable, cacheable, read/write-allocate
  • QoS — AxQOS[3:0]: 16 priority levels for interconnect arbitration

AXI-Lite: single-beat, no burst, no ID — for simple register interfaces. AXI-Stream: unidirectional data streaming (DMA, video, DSP pipes).

13

AXI Handshake & Burst Timing

AXI write burst (INCR, AWLEN=3): address phase → 4 data beats → write response

CLK ── Write Address ── AWVALID AWREADY handshake AWADDR ADDR AWLEN 3 (4-beat burst) ── Write Data ── WVALID WREADY stall WDATA D0 D1 D2 D3 WLAST ↑ last beat ── Write Response ── BVALID BREADY (tied high) BRESP OK Addr Phase Data Phase (4 beats, 1 stall cycle) Resp
14

ACE — AXI Coherency Extensions

ACE extends AXI with three additional channels to support hardware cache coherency between multiple managers.

Additional ACE Channels

  • AC (Snoop Address) — interconnect sends snoop request to cached managers
  • CR (Snoop Response) — manager responds with cache line state
  • CD (Snoop Data) — manager returns dirty data to interconnect

ACE Transaction Types

  • ReadShared — read, others may retain copy
  • ReadUnique — read with exclusive ownership
  • CleanUnique — upgrade shared → exclusive
  • WriteBack — evict dirty line to memory
  • MakeInvalid — invalidate all other copies

ACE Variants

ProtocolCoherencyUse Case
ACEFull (bi-dir snoop)CPU clusters
ACE-LiteI/O coherent (one-way)GPU, DMA, NIC
ACE-Lite+DVM+ Virtual memory syncSMMU-backed I/O
ACE enables Arm's big.LITTLE and DynamIQ architectures where heterogeneous CPU clusters share a coherent memory view without software intervention.
15

AMBA CHI — Coherent Hub Interface

Layered Architecture

Protocol Layer — transactions, coherency, ordering
Network Layer — node IDs, routing, QoS
Link Layer — flit packing, flow control, credits
Physical Layer — wires, clock, parity

Node Types

  • RN-F — Request Node, Full coherent (CPU)
  • RN-I — Request Node, I/O coherent (GPU, DMA)
  • HN-F — Home Node, Full (SLC + snoop filter)
  • SN-F — Subordinate Node (memory controller)
  • MN — Misc Node (debug, DVM)

Why CHI over ACE?

  • Packet-based — replaces ACE's signal-level protocol with flits; reduces wire count by ~30%
  • Scalable — credit-based flow control prevents congestion; supports 100+ agents
  • Retry mechanism — if home node is busy, request can be retried without blocking the network
  • Atomic ops — near-memory atomic operations (AtomicStore, AtomicCompare) reduce round-trips
  • Data poisoning — end-to-end error signaling for RAS
  • MTE — Memory Tagging Extension support (CHI Issue E)
CHI is the native protocol for Arm's CMN-600/700/S3 mesh interconnects and all Neoverse V/N-series server platforms.
16

Cache Coherency

MOESI · Snoop · Directory · Snoop filters · Coherency domains

17

Cache Coherency — MOESI States

StateValidDirtyExclusiveMeaning
Modified✓✓✓Only copy, modified
Owned✓✓✗Dirty, others have Shared
Exclusive✓✗✓Only copy, clean
Shared✓✗✗Clean, others may have copy
Invalid✗✗✗Not cached

MESI (no Owned) used in Intel; MOESI used in AMD. Arm CHI uses a similar model with Unique/Shared/Invalid + Dirty/Clean.

Snoop vs Directory

  • Broadcast snoop — every coherent agent is queried on each miss; simple but O(N) traffic; used in ACE-based systems with ≤8 cores
  • Directory / snoop filter — home node tracks which caches hold each line; targeted snoops; O(1) snoop traffic; essential for 16+ core systems
  • Distributed directory — snoop filter state distributed across HN-F nodes in mesh (CMN-700); scales to 256+ cores
Snoop filter sizing rule of thumb: ≥ 1.5× the aggregate exclusive cache capacity of all coherent agents to avoid costly back-invalidations.
18

Coherency Transaction Flow

Example: CPU0 reads a cache line that CPU1 holds in Modified state

1. CPU0 cache miss → sends ReadShared request to Home Node (HN-F)
2. HN-F checks snoop filter → finds CPU1 holds line in Modified state
3. HN-F sends targeted SnpShared to CPU1 only (directory-based, no broadcast)
4. CPU1 transitions M→Shared, sends dirty data via CompData to HN-F
5. HN-F writes data to SLC, forwards CompData to CPU0; updates snoop filter
6. CPU0 installs line in Shared state; read completes

In CHI, this is a 3-hop transfer (CPU0→HN-F→CPU1→CPU0 via HN-F). The snoop filter avoids broadcasting to all N cores.

19

QoS, Arbitration & Flow Control

Priority · Bandwidth regulation · Virtual channels · Deadlock avoidance

20

Quality of Service in NoC

Traffic Classes

  • Latency-sensitive — CPU demand loads; require low, predictable latency (e.g., <100 ns to DRAM)
  • Latency-critical + BW — display/video pipeline; sustained bandwidth with deadline (frame drops if starved)
  • Best-effort BW — bulk DMA, Ethernet, background copies; can tolerate jitter
  • Signaling — inter-processor interrupts, config register accesses; tiny but urgent

QoS Mechanisms

  • AxQOS priority — AXI 4-bit field (0–15) attached to every transaction; arbiters use it for prioritization
  • Urgency escalation — dynamically raise priority of aging transactions to prevent starvation
  • Bandwidth regulation — rate limiters at NI ports; prevent any single agent from monopolizing links
  • Virtual Channels (VCs) — separate physical link into logically independent channels; prevent head-of-line blocking between traffic classes
  • TDM slots — Time-Division Multiplexing guarantees deterministic bandwidth; used in safety-critical (automotive) NoCs
Key insight: QoS is not just priority — it requires isolation so that misbehaving agents cannot starve critical traffic, and regulation to bound worst-case latency.
21

Arbitration & Flow Control

Arbitration Schemes

SchemePropertyUse
Round-robinFair, simpleDefault in most NoCs
Weighted RRBW proportionalDifferentiated QoS
Fixed priorityDeterministicSafety-critical paths
LotteryProbabilistic fairResearch / soft QoS
Age-basedOldest-firstStarvation prevention

Flow Control

  • Credit-based — sender tracks receiver buffer space via credits; used in CHI. Prevents buffer overflow without back-pressure stalls.
  • Wormhole — packet split into flits; head flit reserves path, body/tail follow. Low buffer cost but can cause head-of-line blocking.
  • Virtual Cut-Through (VCT) — forward as soon as enough buffer exists for entire packet. Higher throughput than wormhole, more buffers.
  • Store-and-Forward — entire packet buffered before forwarding. Highest latency, simplest error handling.
22

Routing Algorithms & Deadlock Avoidance

Routing Strategies

  • Deterministic (XY) — route first in X, then Y dimension; no adaptivity but deadlock-free by construction; simplest hardware
  • Oblivious — fixed path per source-dest pair but can use multiple static routes; load-balanced
  • Adaptive — choose path based on local congestion; higher throughput under non-uniform traffic; needs deadlock avoidance mechanism
  • Source routing — full path embedded in packet header; no per-router routing tables; used in some custom NoCs

Deadlock Avoidance

  • Dimension-ordered routing — XY routing on mesh creates an acyclic channel dependency graph → no deadlock
  • Virtual channel classes — separate request/response/snoop into VCs; break circular dependencies between protocol message classes
  • Turn model — forbid specific turns (e.g., west-first, negative-first) to eliminate cycles while allowing partial adaptivity
  • Escape channels — designate one VC with deterministic routing as an "escape" for adaptive traffic that might deadlock
CHI uses separate virtual networks for REQ, RSP, SNP, and DAT message classes — preventing protocol-level deadlock by design.
23

Commercial NoC IP & Case Studies

Arm CMN · Arteris FlexNoC · Synopsys · AMD Infinity Fabric · Intel Ring/Mesh

24

Commercial NoC IP Landscape

VendorProductTopologyCoherencyNotable Users
Arm CMN-700 / CMN S3 2D Mesh (up to 12×12) CHI, full snoop filter AWS Graviton, Ampere, NVIDIA Grace
Arm NI-700 Packetized tree/star Non-coherent (AXI/CHI transport) Mobile SoCs (peripheral fabric)
Arteris FlexNoC 5 / Ncore Configurable (any) CHI, ACE, AMBA; Ncore = coherent Samsung, Mobileye, many AI SoCs
Synopsys DW AXI / CHI Fabric Configurable crossbar/NoC AXI, ACE-Lite, CHI Broad SoC IP ecosystem
Cadence Interconnect IP Configurable AXI, CHI Tensilica DSP-centric SoCs
NetSpeed (Intel) Orion AI NoC Configurable mesh CHI, CXL Internal Intel + licensable
25

AMD Infinity Fabric

AMD's proprietary scalable interconnect connecting CCDs, IODs, and across sockets.

Intra-CCDL3 cache fabric (256-bit, core clock)
CCD↔IODInfinity Fabric Link (IF, 32B/cycle per dir)
Socket↔SocketxGMI (Global Memory Interconnect)
CoherencyProbe filter (directory) on IOD
ProtocolCustom (not AMBA); loosely maps to CHI concepts
ClockFCLK (Fabric Clock) — tied to DRAM freq in some configs

Key Design Decisions

  • Chiplet-native — designed from the ground up for die-to-die communication between CCD and IOD chiplets
  • NUMA-aware — each CCD has preferred memory channels; OS scheduler considers fabric topology
  • Scalable — same fabric from 1-CCD Ryzen (8 cores) to 16-CCD EPYC (128+ cores), to 2-socket (256+ cores)
  • Bandwidth — each IF link: ~40 GB/s per direction; EPYC 9004: 12 IF links = ~480 GB/s aggregate CCD↔IOD

Infinity Fabric also carries non-coherent traffic (PCIe, SATA, USB) between IOD and peripherals.

26

Intel: Ring → Mesh Interconnect

Ring (Sandy Bridge → Broadwell)

  • Bidirectional ring connecting cores, LLC slices, memory controllers, and I/O agents
  • Simple, low latency for ≤10 cores
  • Bandwidth saturates at ~12–14 cores; latency grows linearly with core count
  • Dual ring used in Haswell-EP (up to 18 cores) to mitigate, but fundamental limit remains

Mesh (Skylake-SP onwards)

  • 2D mesh with XY routing; each tile = core + LLC slice + mesh stop
  • Scales to 128+ P-cores (Granite Rapids) or 288 E-cores (Sierra Forest) per socket via chiplets
  • Snoop filter replaces broadcast for coherency
  • Sub-NUMA clustering: partition mesh into 1, 2, or 4 NUMA domains for latency optimization

Why the Transition?

Ring: O(N) latency

Worst-case hop count = N/2. At 28 cores, half-ring traversal adds ~30 ns to cache access.

Mesh: O(√N) latency

Worst-case = 2(√N−1) hops. At 28 cores (≈5×6), max ~8 hops. Bisection BW scales with √N.

Xeon Scalable (Skylake-SP): first Intel server mesh. Granite Rapids continues with mesh + EMIB chiplet fabric.

27

Advanced Topics

CXL · Chiplet fabrics · 3D NoC · Power management · Functional safety

28

CXL & Chiplet-Level Interconnect

CXL (Compute Express Link)

  • CXL.io — PCIe-based discovery and config (non-coherent)
  • CXL.cache — device caches host memory with coherency
  • CXL.mem — host-managed device memory (memory expansion / pooling)
  • CXL 3.2 / 4.0 — peer-to-peer, fabric switches, global fabric addressing; 4.0 doubles bandwidth (PCIe 7 PHY)

CXL runs over PCIe PHY — reuses existing SerDes; supported in Arm CMN-700/S3 via AMBA CXS bridge.

Die-to-Die (D2D) NoC Extension

  • UCIe 3.0 (2025) — 64 GT/s D2D PHY + protocol; extends NoC across chiplet boundaries with CXL 3.x/PCIe tunnelling
  • BoW (Bunch of Wires) — OCP-defined low-latency parallel D2D for short reach
  • Custom links — AMD IF, NVIDIA NV-HBI, Apple UltraFusion
The NoC must now extend beyond a single die — chiplet fabrics require the interconnect to manage coherency, ordering, and QoS across package-level boundaries with different latency characteristics.
29

Power Management & Functional Safety

NoC Power Techniques

  • Clock gating — idle routers/links gate clocks; AMBA Q-Channel handshake for safe clock stop
  • Power gating — entire NoC regions powered down; requires wake-up latency management
  • DVFS per domain — NI adapters handle clock domain crossing; high-traffic paths run faster
  • Link serialization — reduce wire count on low-BW links; trade latency for fewer active wires
  • GALS — Globally Asynchronous, Locally Synchronous; each IP block has its own clock; NI handles synchronization

Functional Safety (ISO 26262)

  • AMBA parity extension — AXI Issue G+ / CHI Issue E+ add interface parity for transient fault detection
  • End-to-end protection — CRC or ECC on flits across the NoC; detects router/link errors
  • Data poisoning — CHI poison bit marks corrupted data; consumer can handle gracefully
  • TDM scheduling — deterministic time slots guarantee worst-case latency bounds for ASIL-rated paths
  • Lockstep routers — duplicate router logic for ASIL-D; compare outputs cycle-by-cycle
Arteris FlexNoC FuSa Option provides ISO 26262 ASIL-B/D certified NoC IP for automotive SoCs (Mobileye EyeQ, others).
30

Summary & Key Takeaways

  • Interconnect is the SoC backbone — it determines bandwidth, latency, power, and design reusability; consumes 30–40% of chip resources
  • AMBA dominates — from APB (peripherals) through AXI (high-performance) to CHI (scalable coherency), the AMBA suite is the industry standard protocol hierarchy
  • 2D Mesh is the standard topology — Arm CMN, Intel mesh, AMD IF all converged on mesh for its regularity, scalability, and physical design advantages
  • Directory-based coherency scales — snoop filters/directories replaced broadcast snooping as core counts grew beyond ~8; essential for 100+ core designs
  • QoS requires isolation + regulation — priority alone is insufficient; virtual channels, bandwidth limiters, and TDM ensure deterministic behavior
  • NoC now extends across chiplets — UCIe, CXL, and custom D2D links require the interconnect architecture to manage coherency and ordering across die boundaries
31

References & Further Reading

Arm AMBA Specifications — AXI/ACE Issue G, CHI Issue E (arm.com/architecture/amba)
Arm CMN-700 / CMN S3 — Coherent Mesh Network technical reference manuals
Arm NI-700 / CI-700 — SoC and coherent interconnect documentation
Arteris — FlexNoC, Ncore interconnect IP technical documentation
WikiChip Fuse — CMN-700 deep dive (David Schor, 2021)
AnandTech — Neoverse V1/N2, CMN-700 mesh analysis
CXL Consortium — CXL 3.2 (2024) / CXL 4.0 (2025) specifications
UCIe Consortium — Universal Chiplet Interconnect Express 3.0
Bokhari & Parameswaran — "Network-on-Chip Design," Springer, 2020
Bolotin et al. — "QNoC: QoS architecture for network on chip," J. Systems Architecture, 2004
Dally & Towles — Principles and Practices of Interconnection Networks, Morgan Kaufmann, 2004

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